Integrally formed light emitting diode light wire and uses thereof

ABSTRACT

Integrally formed LED light wires are provided, comprising a plurality of dynamically addressible LED modules, each LED module comprising one or more LEDs; a microcontroller; and one or more ports, said microcontroller being configured to: check a status of at least one of said one or more ports; if the status of the port corresponds to a predetermined state: assign the LED module to which said microcontroller belongs to a first display address, and send signals to said microcontroller of a neighboring LED module, said signals assigning respective further display address to the neighboring LED module. Such LED light wires can also include a display memory which stores current display information associated with each of said LED modules in said LED light wire, and a display controller, said display controller being configured to update the current display information stored in said display memory.

CROSS-REFERENCE TO RELATED APPLICATIONS

This utility application is a continuation-in-part of U.S. Ser. No.12/355,655, filed Jan. 16, 2009, which is a continuation-in-part of U.S.Ser. No. 11/854,145, filed Sep. 12, 2007, which claims priority to U.S.Provisional Patent Application Ser. No. 60/844,184, filed Sep. 12, 2006,the entirety of which is incorporated herein by reference.

Throughout this application, several publications are referenced.Disclosure of these references in their entirety is hereby incorporatedby reference into this application.

The present invention relates to light wires and, more specifically, anintegrally formed light wire containing light emitting diodes (“LEDs”),and the uses of such LED light wire, wherein the LEDs and associatedcircuitry of the LED light wire are protected from mechanical damage andenvironmental hazards, such as water and dust.

BACKGROUND THE INVENTION

Conventional incandescent or LED light wires are commonly used in avariety of indoor and outdoor decorative or ornamental lightingapplications. For example, such conventional light wires are used tocreate festive holiday signs, outline architectural structures such asbuildings or harbors, and provide under-car lighting systems. Theselight wires are also used as emergency lighting aids to increasevisibility and communication at night or when conditions, such as poweroutages, water immersion and smoke caused by fires and chemical fog,render normal ambient lighting insufficient for visibility.

Conventional LED light wires consume less power, exhibit a longerlifespan, are relatively inexpensive to manufacture, and are easier toinstall when compared to light tubes using incandescent light bulbs.Increasingly, LED light wires are used as viable replacements for neonlight tubing.

As illustrated in FIG. 1, conventional light wire 100 consists of aplurality of illuminant devices 102, such as incandescent light bulbs orLEDs, connected together by a flexible wire 101 and encapsulated in aprotective tube 103. A power source 105 creates an electrical currentthat flows through the flexible wire 101 causing the illuminant devices102 to illuminate and create an effect of an illuminated wire. Theilluminant devices 102 are connected in series, parallel, or incombination thereof. Also, the illuminant devices 102 are connected withcontrol electronics in such a way that individual illuminant devices 102may be selectively switched on or off to create a combination of lightpatterns, such as strobe, flash, chase, or pulse.

In conventional light wires, the protective tube 103 is traditionally ahollow, transparent or semi-transparent tube which houses the internalcircuitry (e.g., illuminant devices 102; flexible wire 101). Since thereis an air gap between the protective tube 103 and internal circuitry,the protective tube 103 provides little protection for the light wireagainst mechanical damage due to excessive loads, such as the weight ofmachinery that is directly applied to the light wire. Furthermore, theprotective tube 103 does not sufficiently protect the internal circuitryfrom environmental hazards, such as water and dust. As a result, theseconventional light wires 100 with protective tube 103 are foundunsuitable for outdoor use, especially when the light wires are exposedto extreme weather and/or mechanical abuse.

In conventional light wires, wires, such as flexible wire 101, are usedto connect the illuminant devices 102 together. In terms ofmanufacturing, these light wires are traditionally pre-assembled usingsoldering or crimp methods and then encapsulated via a conventionalsheet or hard lamination process in protective tube 103. Suchmanufacturing processes are labor intensive and unreliable. Furthermore,such processes decrease the flexibility of the light wire.

In response to the above-mentioned limitations associated withconventional light wires and the manufacture thereof, LED light stripshave been developed with increased complexity and protection. These LEDlight strips consist of circuitry including a plurality of LEDs mountedon a support substrate containing a printed circuit and connected to twoseparate electrical conductors or bus elements. The LED circuitry andthe electrical conductors are encapsulated in a protective encapsulantwithout internal voids (which includes gas bubbles) or impurities, andare connected to a power source. These LED light strips are manufacturedby an automated system that includes a complex LED circuit assemblyprocess and a soft lamination process. Examples of these LED lightstrips and the manufacture thereof are discussed in U.S. Pat. Nos.5,848,837, 5,927,845 and 6,673,292, all entitled “Integrally FormedLinear Light Strip With Light Emitting Diode”; U.S. Pat. No. 6,113,248,entitled “Automated System For Manufacturing An LED Light Strip HavingAn Integrally Formed Connected”; and U.S. Pat. No. 6,673,277, entitled“Method of Manufacturing a Light Guide”.

Although these LED light strips are better protected from mechanicaldamage and environmental hazards, these LED light strips only provideone-way light direction, and are limited to two separate bus elements inits internal LED circuitry. Also, the manufacturing of such LED lightstrips remains expensive and time-consuming since these LED light stripsat least require a protective encapsulant free of internal voids andimpurities, as well as crimping each LED connector pin to the internalLED circuitry. Further, the lamination process makes these LED lightstrips too rigid to bend.

SUMMARY OF THE INVENTION

In light of the above, there exists a need to further improve the art.Specifically, there is a need for an improved integrally formed LEDlight wire that is flexible and provides a smooth, uniform lightingeffect from all directions of the integrally formed LED light wire.There is also a need for an LED light wire with additional lightingfunctions which is manufactured by a low cost, time-efficient automatedprocess. Furthermore, there is a need for a LED light wire whichintelligently recognizes, responds and adapts to changes associated withinstallation, maintenance and failure detection.

In consideration of the above problems, in accordance with a firstaspect of the present invention, an integrally formed LED light wire isprovided, comprising a plurality of LED modules, each LED modulecomprising one or more LEDs; a microcontroller; and one or more ports,said microcontroller being configured to: check a status of at least oneof said one or more ports; if the status of the port corresponds to apredetermined state: assign the LED module to which said microcontrollerbelongs to a first display address, and send signals to saidmicrocontroller of a neighboring (or adjacent) LED module, said signalsassigning respective further display address to the neighboring LEDmodule.

In another aspect, the integrally formed LED wire further comprises adisplay memory, electrically coupled to said plurality of LED modules,said display memory storing current display information associated witheach of said LED modules in said integrally formed LED light wire, saidcurrent display information stored in said display memory beingaccessible by each of the microcontrollers of the LED modules, such thatsaid microcontrollers can retrieve current display information.

In another aspect, the integrally formed LED light wire furthercomprises a display controller, said display controller being configuredto update the current display information stored in said display memory.

In another aspect, the one or more LEDs in each said LED module comprisea red, blue, green or white LED. In another aspect, the one or more LEDsin each said LED module can also be either red, blue and green LEDs, orred, blue, green and white LEDs.

In yet another aspect, the present invention is directed to anintegrally formed LED light wire, comprising a first bus element formedfrom a conductive material adapted to distribute power from a powersource; a second bus element formed from a conductive material adaptedto transmit a control signal; a third bus element formed from aconductive material adapted as a ground; at least two LED modules, eachof said LED modules comprising a microcontroller and at least one LED,said LED module being electrically coupled to said first, second andthird bus elements; one or more ports, said microcontroller beingconfigured to check a status of at least one of said one or more ports,and if the status of the port corresponds to a predetermined state:assign said LED module to which said microcontroller belongs to a firstdisplay address, and send signals to the microcontroller of aneighboring LED module, said signals assigning respective furtherdisplay address to said neighboring LED module.

In another aspect, the integrally formed LED light wire furthercomprises a display memory, electrically coupled to said at least twoLED modules, said display memory storing current display informationassociated with each of the LED modules, said current displayinformation stored in said display memory being accessible by each ofthe microcontrollers of the LED modules, such that said microcontrollerscan retrieve current display information.

In another aspect, the integrally formed LED light wire furthercomprises a display controller, said display controller being configuredto update the current display information stored in said display memory.

In another aspect, the first, second and third bus elements are made ofbraided wire.

In another aspect, the integrally formed LED light wire furthercomprises an encapsulant completely encapsulating said first, second,and third bus elements, and said at least two LED modules. In anotheraspect, the encapsulant further comprises light scattering particles.

In yet another aspect, the present invention is directed to anintegrally formed LED light wire, comprising a support substrate; aconductive base mounted on said support substrate, said conductive basecomprising a first, second and third conductive bus elements, whereinsaid first conductive bus element is adapted to distribute power from apower source, said second conductive bus element is adapted to transmita control signal, and said third conductive bus element is adapted as aground; at least two LED modules, each of said LED modules, comprising amicrocontroller and at least one LED, said LED modules beingelectrically coupled to said first, second and third conductive buselements; one or more ports; said microcontroller being configured tocheck a status of at least one of the one or more ports, and if thestatus of the port corresponds to a predetermined state: assign the LEDmodule to which said microcontroller belongs to a first display address,and send signals to the microcontroller of a neighboring LED module,said signals assigning respective further display address to theneighboring LED module; and a display memory, electrically coupled tosaid at least two LED modules, said display memory storing a currentdisplay information for each of said LED modules, said current displayinformation stored in said display memory being accessible by each LEDmodule, such that said LED modules can request and retrieve currentdisplay information.

In another aspect, the integrally formed LED light wire furthercomprises an encapsulant completely encapsulating said supportsubstrate, said conductive base, said at least two LED modules. Theencapsulant can include light scattering particles.

In another aspect, the integrally formed LED light wire furthercomprises at least one sensor or detector coupled to any one ofconductive bus elements.

In another aspect, the outer profile of the encapsulant comprises analignment key and an alignment keyhole located at opposite sides of theintegrally formed LED light wire.

In yet another aspect, the present invention is directed to a lightingpanel comprising a plurality of the integrally formed LED light wiresmentioned above, having an outer profile of the encapsulant comprisingan alignment key and an alignment keyhole located at opposite sides ofthe integrally formed LED light wire.

BRIEF DESCRIPTION OF THE FIGURES

For the purposes of illustrating the present invention, the drawingsreflect a form which is presently preferred; it being understoodhowever, that the invention is not limited to the precise form shown bythe drawings in which:

FIG. 1 is a representation of a conventional light wire;

FIG. 2 is a top view illustrating an integrally formed LED light wireaccording to an embodiment of the present invention;

FIG. 3 is a cross-sectional view of the integrally formed LED light wireshown in FIG. 2;

FIG. 4A is a side view of an integrally formed LED light wire accordingto another embodiment of the present invention;

FIG. 4B is a top view of the integrally formed LED light wire shown inFIG. 4B;

FIG. 5A is a cross-sectional view of the integrally formed LED lightwire shown in FIGS. 4A & 4B;

FIG. 5B is a cross-sectional view of an integrally formed LED light wireaccording to another embodiment of the present invention;

FIG. 6A is an embodiment of a conductive base;

FIG. 6B is a schematic diagram of the conductive base of FIG. 6A;

FIG. 7A is another embodiment of a conductive base;

FIG. 7B is a schematic diagram of the conductive base of FIG. 7A;

FIG. 8A is another embodiment of a conductive base;

FIG. 8B is a schematic diagram of the conductive base of FIG. 8A;

FIG. 9A is another embodiment of a conductive base;

FIG. 9B is a schematic diagram of the conductive base of FIG. 9A;

FIG. 10A is another embodiment of a conductive base;

FIG. 10B is a schematic diagram of the conductive base of FIG. 10A;

FIG. 11A is another embodiment of a conductive base;

FIG. 11B is a schematic diagram of the conductive base of FIG. 11A;

FIG. 11C depicts an embodiment of a conductive base wrapped on a coreprior to encapsulation;

FIG. 12A depicts an embodiment of an LED mounting area of a conductivebase;

FIG. 12B depicts an LED mounted on the LED mounting area shown in FIG.12A;

FIG. 13 depicts LED chip bonding in another embodiment of an LEDmounting area;

FIG. 14A depicts the optical properties of an integrally formed LEDlight wire according to an embodiment of the present invention;

FIG. 14B depicts a cross-sectional view of a dome-shaped encapsulant andthe optical properties thereof;

FIG. 14C depicts a cross-sectional view of a flat-top-shaped encapsulantand the optical properties thereof;

FIGS. 15A-C depict a cross-sectional view of three different surfacetextures of the encapsulant;

FIG. 16A is a schematic diagram of an integrally formed LED light wireaccording to an embodiment of the present invention;

FIG. 16B depicts an embodiment of the integrally formed LED light wireshown in FIG. 16A;

FIG. 16C is a block diagram illustrating the integrally formed LED lightwire shown in FIG. 16B;

FIG. 17A is a block diagram of an integrally formed LED light wireaccording to another embodiment of the present invention;

FIG. 17B is a cross-sectional view of the integrally formed LED lightwire shown in FIG. 17A;

FIG. 17C is a block diagram illustrating an integrally formed LED lightwire according to an embodiment of the present invention;

FIG. 18 is a block diagram illustrating an integrally formed LED lightwire containing at least a sensor or detector according to an embodimentof the present invention;

FIG. 19A is a schematic diagram of a full color integrally formed LEDlight wire according to an embodiment of the present invention;

FIG. 19B is a block diagram illustrating an embodiment of the integrallyformed LED light wire shown in FIG. 19A;

FIG. 20 is a schematic diagram of a control circuit for a full colorintegrally formed LED light wire;

FIG. 21 is a timing diagram for a full color integrally formed LED lightwire;

FIG. 22A is a timing diagram for a full color integrally formed LEDlight wire;

FIG. 22B is a timing diagram for a full color integrally formed LEDlight wire;

FIG. 23 is a schematic diagram of an integrally formed LED light wirecontaining a plurality of LED modules according to an embodiment of thepresent invention;

FIG. 24 is a layout diagram of the integrally formed LED light wireshown in FIG. 23;

FIG. 25A is a block diagram illustrating a lighting panel comprising aplurality of integrally formed LED light wires with interlockingalignment system according to an embodiment of the present invention;

FIG. 25B is a cross-sectional view of the lighting panel shown in FIG.25A;

FIG. 25C is a cross-sectional view of a lighting panel comprising aplurality of integrally formed LED light wires according to anotherembodiment of the present invention

FIG. 26 is a diagram showing an LED module suitable for use in dynamicaddressing in the integrally formed LED light wire described in thepresent application; and

FIG. 27 is a diagram showing plural LED modules as shown in FIG. 26connected in a light wire configuration.

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to an integrally formed LED light wirecontaining a plurality of LEDs that are connected in series, parallel ora combination thereof on at least one conductive bus element which formsa mounting base or on at least two conductive bus elements mounted on asupport substrate made of insulating material (e.g., plastic) to providea mounting base. The mounting base provides electrical connection and aphysical mounting platform or a mechanical support for the LEDs. Themounting base can also act as or include a light reflector for the LEDs.The mounting base and LEDs are encapsulated in a transparent orsemi-transparent encapsulant which may contain light scatteringparticles.

In one embodiment of the present invention, as shown in FIGS. 2 and 3,an integral LED light wire, which includes a sub-assembly 310 comprisingat least one LED 202 connected to a conductive base 201, thesub-assembly 310 is encapsulated within an encapsulant 303, and theconductive base 201 comprises one conductive bus element formed from aconductive material capable of distributing power from a power source.As shown in FIG. 2, the LEDs 202 are connected in series. Thisembodiment offers the advantage of compactness in size, and allows theproduction of a long, thin LED light wire with an outer diameter of 3 mmor less. The conductive base 201 is operatively connected to a powersource 205 to conduct electricity.

In another embodiment, as illustrated in FIGS. 4A, 4B, and 5A, thepresent invention may be an integrally formed LED light wire 400comprising a plurality of sub-assemblies 510. Each sub-assembly 510comprises at least one LED 202 connected to a conductive base 401,wherein the conductive base 401 has two conductive bus elements 401A and401B. The sub-assemblies 510 are encapsulated within an encapsulant 503.As shown, the LEDs 202 are connected in parallel. The conductive base401 is operatively connected to a power source 405 to activate LEDs 202.

In another embodiment, as shown in FIG. 5B, the present invention mayinclude a plurality of sub-assemblies 750. Each sub-assembly 750includes at least one LED 202 (for example, a SMD-On-Board LED)connected to a conductive base 94 having at least two conductive buselements 94A and 94B, wherein the conductive base 94 is mounted on asupport substrate 90.

AC or DC power from a power source, such as power source 405, may beused to power the integrally formed LED light wire. Additionally, acurrent source may be used. Brightness may be controlled by digital oranalog controllers.

The conductive base 94, 201, 401 extends longitudinally along the lengthof the integrally formed LED light wire, and act as an electricalconductor, and as a physical mounting platform or a mechanical supportfor the LEDs 202. The conductive base can also act as or include a lightreflector for the LEDs 202.

The conductive base 201, 401 may be, for example, punched, stamped,printed, silk-screen printed, or laser cut, or the like, from a metalplate or foil to provide the basis of an electrical circuit, and may bein the form of a thin film or flat strip. The conductive bus elements ofconductive base 94, 201, 401, and conductive segments (discussed below)may also be formed using rigid electrical conductive materials (such asmetal rod, metal strip, copper plate, copper clad steel plate, metalstrip, a rigid base material coated with an electrically conductivematerial, or the like), or flexible electrical conductive materials(such as thin metal strip, copper clad alloy wire, stranded wire,braided wire, or the like). Stranded wire or braided wire may be flat orround, and comprises a plurality of electrical conductive fine wiresmade of copper, brass, aluminum, or the like; such fine wires may bebare or coated with electrical conductive materials including, but notlimited to, tin, nickel, silver, or the like. Metal, mentioned in thisparagraph, may include copper, brass, aluminum, or the like.

In a preferred embodiment, flat braided wire is used as conductive buselements or conductive segments, said conductive bus elements orconductive segments are flexible. The use of flat braided wire in thepresent invention promotes increased flexibility in a directionperpendicular to the length of the flat conductive bus elements. Also,flat braided wire provides higher thermal conductivity to dissipate moreefficiently the heat from the LEDs, thereby allowing the presentinvention to operate at higher power and achieve greater brightness thanconventional light wires with solid flat strips.

Also, generally speaking, the maximum length of the LED light wires isdetermined by the conductivity of the conductive bus elements. Inconventional LED light wires, the voltage drop in the power busincreases as the LED light wires becomes longer due to its resistanceand increasing current flow drawn by the increasing load of additionalLEDs. Eventually, the voltage drop becomes too great at a particularmaximum length of the LED light wire. In an aspect of the presentinvention, the maximum length of the integrally formed LED light wirecan be increased by increasing the cross-sectional area of theconductive bus (e.g., increasing the gauge of braided wire used asconductive bus elements or segments), thereby reducing its resistanceper unit length.

The conductive bus elements of conductive base 94 may be mounted on asupport substrate 90 via adhesion, lamination, extrusion, or casting.The support substrate 90 may be made of rigid or flexible plastic, suchas polyethylene terephthalate (PET), polyvinyl chloride (PVC), andthermoplastic polyurethane (TPU).

Additional circuitry, such as active or passive control circuitcomponents (e.g., a microprocessor, a resistor, a capacitor), may beadded and encapsulated within an encapsulant to add functionality to theintegrally formed LED light wire. Such functionality may include, butnot limited to, current limiting (e.g., resistor 10), protection,flashing capability, or brightness control. For example, amicrocontroller or microprocessor may be included to make the LEDs 202individually addressable; thereby, enabling the end user to control theillumination of selective LEDs 202 in the LED light wire to form avariety of light patterns, e.g., strobe, flash, chase, or pulse. In oneembodiment, external control circuitry is connected to the conductivebase 94, 201, 401.

First Embodiment of the Conductive Base

In a first embodiment of the conductive base assembly 600, shown in FIG.6A, the base material of the conductive base 601 is preferably a longthin narrow metal strip or foil. In one embodiment, the base material iscopper. A hole pattern 602, shown as the shaded region of FIG. 6A,depict areas where material from the conductive base 601 has beenremoved. In one embodiment, the material has been removed by a punchingmachine. The remaining material of the conductive base 601 forms thecircuit of the present invention. Alternatively, the circuit may beprinted on the conductive base 601 and then an etching process is usedto remove the areas 602. The pilot holes 605 on the conductive base 600act as a guide for manufacture and assembly.

The LEDs 202 are mounted either by surface mounting or LED chip bondingand soldered, welded, riveted or otherwise electrically connected to theconductive base 601 as shown in FIG. 6A. The mounting and soldering ofthe LEDs 202 onto the conductive base 601 not only puts the LEDs 202into the circuit, but also uses the LEDs 202 to mechanically hold thedifferent unpunched parts of the conductive base 601 together. In thisembodiment of the conductive base 601 all of the LEDs 202 areshort-circuited, as shown in FIG. 6B. Thus, additional portions ofconductive base 601 are removed as discussed below so that the LEDs 202are not short-circuited. In one embodiment, the material from theconductive base 601 is removed after the LEDs 202 are mounted.

Second Embodiment of the Conductive Base

To create series and/or parallel circuitries, additional material isremoved from the conductive base. For example, additional portions ofthe conductive base are removed between the terminals of the LEDs 202after the LEDs 202 are mounted on the conductive base; thereby, creatingat least two conductors wherein each conductor is electrically separate,but then coupled to each other via the LEDs 202. As shown in FIG. 7A,the conductive base 701 has an alternative hole pattern 702 relative tothe hole pattern 602 depicted in FIG. 6A. With the alternative holepattern 702, the LEDs 202 (such as the three shown in FIGS. 7A and 7B)are connected in series on the conductive base 701. The seriesconnection is shown in FIG. 7B, which is a schematic diagram of theconductive base assembly 700 shown in FIG. 7A. As shown, the mountingportions of LEDs 202 provide support for the conductive base 701.

Third Embodiment of the Conductive Base

In a third embodiment of the conductive base, as shown in FIG. 8A, aconductive base assembly 800 is depicted having a pattern 802 that ispunched out or etched into the conductive base 801. Pattern 802 reducesthe number of punched-out gaps required and increase the spacing betweensuch gaps. Pilot holes 805 act as a guide for the manufacturing andassembly process. As shown in FIG. 8B, the LEDs 202 are short-circuitedwithout the removal of additional material. In one embodiment, thematerial from conductive base 801 is removed after the LEDs 202 aremounted.

Fourth Embodiment of the Conductive Base

As illustrated in FIG. 9A, a fourth embodiment of the conductive baseassembly 900 contains an alternative hole pattern 902 that, in oneembodiment, is absent of any pilot holes. Compared to the thirdembodiment, more gaps are punched out in order to create two conductingportions in the conductive base 901. Thus, as shown in FIG. 9B, thisembodiment has a working circuit where the LEDs 202 connected in series.

Fifth and Sixth Embodiments of the Conductive Base

FIG. 10A illustrates a fifth embodiment of conductive base assembly 1000of the conductive base 1001. Shown is a thin LED light wire with atypical outer diameter of 3 mm or less. As shown in FIG. 10A, (1) theLEDs 202 connected on the conductive base 1001 are placed apart,preferably at a predetermined distance. In a typical application, theLEDs 202 are spaced from 3 cm to 1 m, depending upon, among otherthings, at least the power of the LEDs used and whether such LEDs aretop or side-emitting. The conductive base 1001 is shown absent of anypilot holes. The punched-out gaps that create a first hole pattern 1014that are straightened into long thin rectangular shapes. The gaps 1030under the LEDs 202 are punched out after the LEDs 202 are mounted toconductive base 1001, or, in the alternative, LEDs 202 are mounted overpunched-out gaps 1030. However, as shown in FIG. 10B, the resultantcircuit for this embodiment is not useful since all the LEDs 202 areshort-circuited. In subsequent procedures, additional material isremoved from conductive base 1001 so that LEDs 202 are in series orparallel as desired.

In the sixth embodiment of the conductive base assembly 1100, conductivebase 1101, as shown in FIG. 11A, contains a hole pattern 1118 whichcreates a working circuit in the conductive base 1101 with a seriesconnections of LEDs 202 mounted onto the conductive base 1101. Thisembodiment is useful in creating a thin LED light wire with a typicaloutside diameter of 3 mm or less.

LEDs

The LEDs 202 may be, but are not limited to, individually-packaged LEDs,chip-on-board (“COB”) LEDs, leaded LEDs, surface mount LEDs,SMD-On-Board LEDs, or LED dies individually die-bonded to the conductivebase 301. The PCB for COB LEDs and SMD-On-Board LEDs may be, forexample, FR4 PCB, flexible PCB, or metal-core PCB. The LEDs 202 may alsobe top-emitting LEDs, side-emitting LEDs, or a combination thereof.

The LEDs 202 are not limited to single colored LEDs. Multiple-coloredLEDs may also be used. For example, if Red/Blue/Green LEDs (RGB LEDs)are used to create a pixel, combined with a variable luminance control,the colors at each pixel can combine to form a range of colors.

Mounting of LEDs onto the Conductive Base

As indicated above, LEDs 202 are mounted onto the conductive base bymethods known in the art, including surface mounting, LED chip bonding,spot welding and laser welding.

In surface mounting, as shown in FIGS. 12A and 12B, the conductive base1201 is first punched to assume any one of the embodiments discussedabove, and then stamped to create an LED mounting area 1210. The LEDmounting area 1210 shown is exemplary, and other variations of the LEDmounting area 1210 are possible. For example, the LED mounting area 1210may be stamped into any shape which can hold an LED 202, or not stamped.

A soldering material 1210 (e.g., liquid solder; solder cream; solderpaste; and any other soldering material known in the art) or conductiveepoxy is placed either manually or by a programmable assembly system inthe LED mounting area 1220, as illustrated in FIG. 12A. LEDs 202 arethen placed either manually or by a programmable pick and place stationon top of the soldering material 1210 or a suitable conductive epoxy.The conductive base 1201 with a plurality of LEDs 202 individuallymounted on top of the soldering material 1210 may directly go into aprogrammable reflow chamber where the soldering material 1210 is meltedor a curing oven where the conductive epoxy is cured. As a result, theLEDs 202 are bonded to the conductive base 1201 as shown in FIG. 12B.

As illustrated in FIG. 13, LEDs 202 may be mounted onto the conductivebase 1301 by LED chip bonding. The conductive base 1301 is stamped tocreate a LED mounting area 1330. The LED mounting area 1330 shown inFIG. 13 is exemplary, and other variations of the LED mounting area1330, including stamped shapes, like the one shown in FIG. 12A, whichcan hold an LED, are envisioned. LEDs 202, preferably an LED chip, areplaced either manually or by a programmable LED pick place machine ontothe LED mounting area 1330. The LEDs 202 are then wire bonded onto theconductive base 1301 using a wire 1340. It should be noted that wirebonding includes ball bonding, wedge bonding, and the like.Alternatively, LEDs 202 may be mounted onto the conductive base 301using a conductive glue or a clamp.

It should be noted that the conductive base in the above embodiments canbe twisted in an “S” shape. Then, the twisting is reversed in theopposite direction for another predetermined number of rotations;thereby, making the conductive base form a shape of a “Z”. This “S-Z”twisted conductive base is then covered by an encapsulant. With its“S-Z” twisted placement, this embodiment will have increasedflexibility, as well as emit light uniformly over 360°.

In another embodiment, as shown in FIG. 11C, conductive base (e.g.,conductive base 1101) delivering electrical current to the LEDs is woundinto spirals. The spiraling process can be carried out by a conventionalspiraling machine, where the conductive base is placed on a rotatingtable and a core 9000 passes through a hole in the center of the table.The pitch of the LED is determined by the ratio of the rotation speedand linear speed of the spiraled assembly. The core 9000 may be in anythree-dimensional shape, such as a cylinder, a rectangular prism, acube, a cone, a triangular prism, and may be made of, but not limitedto, polymeric materials such as polyvinyl chloride (PVC), polystyrene,ethylene vinyl acetate (EVA), polymethylmethacrylate (PMMA) or the like,or, in one embodiment, elastomer materials such as silicon rubber. Thecore 9000 may also be solid. In one embodiment, the conductive basedelivering electrical current to the LEDs is wound into spirals on asolid plastic core and then encapsulated in a transparent elastomerencapsulant.

Encapsulant

The encapsulant provides protection against environmental elements, suchas water and dust, and damage due to loads placed on the integral LEDlight wire. The encapsulant may be flexible or rigid, and transparent,semi-transparent, opaque, and/or colored. The encapsulant may be madeof, but not limited to, polymeric materials such as polyvinyl chloride(PVC), polystyrene, ethylene vinyl acetate (EVA), polymethylmethacrylate(PMMA) or other similar materials or, in one embodiment, elastomermaterials such as silicon rubber.

Fabrication techniques concerning the encapsulant include, withoutlimitation, extrusion, casting, molding, laminating, injection molding,or a combination thereof.

In addition to its protective properties, the encapsulant can assist inthe scattering and guiding of light in the LED light wire. Asillustrated in FIG. 14, that part of the light from the LEDs 202 whichsatisfies the total internal reflection condition will be reflected onthe surface of the encapsulant 1403 and transmitted longitudinally alongthe encapsulant 1403. Light scattering particles 1404 may be included inthe encapsulant 1403 to redirect such parts of the light as shown bylight path 1406, as well as attenuate or eliminate hot spots of light.The light scattering particles 1404 are of a size chosen for thewavelength of the light emitted from the LEDs. In a typical application,the light scattering particles 1404 have a diameter in the scale ofnanometers and they can be added to the polymer either before or duringthe extrusion process. Further, as shown in FIG. 14A, conductive base1401 can also act as or include a light reflector within the LED lightwire.

The light scattering particles 1404 may also be a chemical by-productassociated with the preparation of the encapsulant 1403. Any materialthat has a particle size (e.g., a diameter in the scale of nanometers)which permits light to scatter in a forward direction can be a lightscattering particle.

The concentration of the light scattering particles 1404 is varied byadding or removing the particles. For example, the light scatteringparticles 1404 may be in the form of a dopant added to the startingmaterial(s) before or during the extrusion process. Also, air bubbles orany other internal voids may be used as a light scattering particle1404. The concentration of the light scattering material 1404 within theencapsulant 1403 is influenced by the distance between LEDs, thebrightness of the LEDs, and the uniformity of the light. A higherconcentration of light scattering material 1404 may increase thedistance between neighboring LEDs 202 within the LED light wire. Thebrightness of the LED light wire may be increased by employing a highconcentration of light scattering material 1404 together within closerspacing of the LEDs 202 and/or using brighter LEDs 202. The smoothnessand uniformity of the light within the LED light wire can be improved byincreasing the concentration of light scattering material 1404 mayincrease such smoothness and uniformity.

As shown in FIGS. 3, 5A and 5B, the sub-assemblies 310, 510 and 750 aresubstantially at the center of the encapsulant. The sub-assemblies 310,510 and 750 are not limited to this location within the encapsulant. Thesub-assemblies 310, 510 and 750 may be located anywhere within theencapsulant. Additionally, the cross-sectional profile of theencapsulant is not restricted to circular or oval shapes, and may be anyshape (e.g., square, rectangular, trapezoidal, star). Also, thecross-sectional profile of the encapsulant may be optimized to provideeither a narrow or wide viewing angle (see light paths 1450 and 1460 inFIGS. 14B (dome-shaped profile of encapsulant 222) and 14C (flat-topprofile of encapsulant 223), respectively) and/or lensing for lightemitted by the LEDs 202. For example, another thin layer of encapsulantmay be added outside the original encapsulant to further control theuniformity of the emitted light from the present invention.

Surface Texturing and Lensing

The surface of the integral LED light wire can be textured and/or lensedfor optical effects. The integral LED light wire may be coated (e.g.,with a fluorescent material), or include additional layers to controlthe optical properties (e.g., the diffusion and consistency ofilluminance) of the LED light wire. Additionally, a mask may be appliedto the outside of the encapsulant to provide different textures orpatterns.

Different design shapes or patterns may also be created at the surfaceof the encapsulant by means of hot embossing, stamping, printing and/orcutting techniques to provide special functions such as lensing,focusing, and/or scattering effects. As shown in FIGS. 15A-C, thepresent invention includes formal or organic shapes or patterns (e.g.,dome, waves, ridges) which influences light rays 1500 to collimate (FIG.15A), focus (FIG. 15B), or scatter/diffuse (FIG. 15C). The surface ofthe encapsulant may be textured or stamped during or following extrusionto create additional lensing. Additionally, the encapsulant 93, 303 and503 may be made with multiple layers of different refractive indexmaterials in order to control the degree of diffusion.

Applications of Integrally Formed LED Light Wire

The present invention of the integrally formed LED light wire finds manylighting applications. The following are some examples such as LED lightwires with 360° Illumination, full color LED light wires, LED lightwires with sensor or detectors, and LED light wires with individuallycontrolled LEDs. Also, the LED light wires may aligned side-by-side orstacked in order to create a lighting panel. It should be noted thatthese are only some of the possible light wire applications.

The three copper wires 161, 162, 163 delivering electrical power to theLEDs 202 shown in FIG. 16B forming the conductive base may be wound intospirals (see FIG. 11C). The LEDs are connected to the conductors bysoldering, ultrasonic welding or resistance welding. Each neighboringLED can be orientated at the same angle or be orientated at differentangles. For example, one LED is facing the front, the next LED is facingthe top, the third LED is facing the back, and the fourth one is facingthe bottom etc. Thus, the integrally formed LED light wire canilluminate the whole surrounding in 360°.

An embodiment of the integrally formed LED light wire is shown in FIGS.16B and 16C. As shown, there are two continuous conductors identified asconductive bus elements 161 and 163. Zero ohm jumpers or resistors 10couple conductor segments 162 to conductive bus elements 161 and 163 toprovide power to LED elements 202. As shown in FIG. 16B, conductive buselements 161 and 163 are mounted on a support substrate 90. In apreferred embodiment, the conductive bus elements 161 and 163 andsupport substrate 90 are flexible. In another embodiment, the LED lightwire with flexible support substrate is wound in spirals about a core9000 (see, for example, FIG. 11C), and then is encapsulated in anencapsulant.

The integrally formed LED light wire is not limited to single color. Forfull color application, the single color LED is replaced by multipleLEDs or an LED group consisting of four sub-LEDs in four differentcolors: red, blue, green, and white as shown in FIG. 20. The intensityof each LED group (one pixel) can be controlled by adjusting the voltageapplied across each sub-LED. The intensity of each LED is controlled bya circuit such as the one shown in FIG. 20.

In FIG. 20, L1, L2, and L3 are the three signal wires for supplyingelectric powers to the four LEDs in each pixel. The color intensity ofeach sub-LED is controlled by a μController 6000 with the timing chartgiven in FIG. 21.

As shown in FIG. 21, because the line voltage L2 is higher than the linevoltage L1 over the first segment of time, the red LED (R) is turned on,whereas, during the same time interval, all the other LEDs are reversebiased and hence they are turned off. Similarly, in the second timeinterval, L2 is higher than L3 thus turning on the green LED (G) andturning off all the other LEDs. The turning on/off of other LEDs insubsequent time segments follows the same reasoning.

New colors such as cold white and orange apart from the four basic onescan be obtained by mixing the appropriate basic colors over a fractionof a unit switching time. This can be achieved by programming amicroprocessor built into the circuit. FIGS. 22A and FIG. 22B show thetiming diagrams of color rendering for cold white and orangerespectively. It should be noted that the entire color spectrum can berepresented by varying the timing of signals L1, L2, and L3.

In one embodiment of the invention, the integrally formed LED light wireincludes a plurality of pixels (LED modules), wherein each pixel has oneor more LEDs, and each pixel can be controlled independently using amicroprocessor circuit integrated with said one or more LEDs. Each pixelis a LED module comprising a microcontroller and at least one or moreLEDs (e.g., a single R,G,B, or W LED, three (RGB) LEDs, or four (RGBW)LEDs). FIG. 27 illustrates an exemplary plurality of pixels (LED modules2100), each pixel with four (RGBW) LEDs. Each LED module 2100 isassigned a unique address. When this address is triggered, that LEDmodule is lit up. The LED modules are serially connected with a signalwire based on a daisy chain or star bus configuration. Alternatively,the LED modules 2100 are arranged in parallel.

There are two ways to assign an address for each LED module in theintegrally formed LED light wire. The first approach is staticaddressing in which each pixel is pre-assigned a fixed address duringmanufacture, and is unable to monitor any changes, particularly as topixel failure or a changed length of the LED light wire. The secondapproach is dynamic addressing in which each pixel is assigned anaddress dynamically with its own unique address and each pixel beingcharacterized by its own “address” periodically with a trigger signal.Alternatively, the address is assigned dynamically when powered on.Because dynamic addressing allows the LED modules to reconfigure theiraddressing based on the signals received at an LED module, theintegrally LED light wires which use such dynamically addressable LEDmodules can achieve flexibility as to installation, maintenance, failuredetection and repair.

In an embodiment, the integrally formed LED light wire includes pixels(LED modules) in which the addresses of the pixels are assigneddynamically, by the pixels themselves, rather than preset duringmanufacture, as in static addressing. As shown in FIGS. 26 and 27, eachLED module 2000 preferably comprises LEDs 2004 (either R,G, B or W LEDs,or a combination thereof); a microcontroller 2002; a data port (DATA);two I/O ports, one of which is configured to be the output port (SO) andone of which is configured to be the input port (S1); one power port(VCC); and one ground port (GND). The diagrammatic layout and wiring ofan individual LED module 2000 is shown in FIG. 26.

The function of microcontroller 2002 in each LED module 2000 is to (a)receive data from its own data port and to receive commands and graphicsignals, (b) process the dynamic address system, and (c) drive theLED(s) in their own LED module, each LED module forming a pixel.

The LED modules 2000 are preferably connected as follows:

-   -   The VCC and GND ports are each connected to the power and ground        buses, respectively.    -   The DATA ports are connected a common bus. Such common bus can        transmit control signals to and from LED modules. A control        signal can be, for example, a request from a LED module to the        remote display memory 2006 for data (e.g., display data (e.g.,        current display information)), or data from remote display        memory 2006 to a specific LED module regarding current display        information.    -   The I/O ports is an out-port and is grounded and the I/O ports        S1 is an in-port and is connected to VCC. The in- and out-ports        of neighboring LED modules are interconnected as shown in        schematic form in FIG. 27. The in-port (S1) of the last LED        module in the integrally formed LED light wire only has a        connection to its out-port (S0), while its in-port (S1) is left        open, designating this particular LED module as the initiating        LED module for dynamic addressing when the LED light wire is        powered up. In the illustrated embodiment, the last LED module        is assigned position No. 0.

That is, the microcontroller of the LED module checks the status of itsinput port, and if that port is in an unconnected state, recognizes thatthe pixel to which it belongs should be assigned position 0. Themicrocontroller of LED module assigned position No. 0 then startsdynamically addressing by communicating its position to its neighboringLED module as No. 0 pixel and assigning thereby its neighbor's addressas No. 1. The pixel with an address so assigned then communicates withits succeeding neighboring LED module, in a daisy chain recursion,assigning addresses as shown in FIG. 27. In this manner, the individualpixels, each controlled by a microcontroller, assign their own addresseswhen powered up and can re-assign the own addresses should the one pixelfail or the LED light wire is cut. It should be noted that the status ofthe ports recognized by the microcontroller is not limited to being anopen state, but may be any predetermined state that could be recognizedby the microcontroller as being indicative of no connection.

In a preferred embodiment, all of the LED modules 2000 share a singledata line and each LED module sends to the remote display memory 2006requests for data (e.g., display data (e.g., current displayinformation)), which data is changed and refreshed by the displaycontroller 2008. The display controller 2008 would typically beprogrammed to update the display data in the display memory 2006, andeach pixel (LED module) picks up its respective data from the displaymemory 2006. A function of the display controller 2008 is to change andrefresh the display memory. The display memory 2006 and displaycontroller 2008 would preferably communicate with one another by the useof address bus 2010 and data bus 2012, as is known to those skilled inthe art.

The integrally formed LED light wires containing LED modules can be cutto any desired length, even when powered on and functioning. If theintegrally formed LED light wire is either cut while powered on, or cutwhile powered off and afterwards powered on, the cut creates an opencircuit and the S1 port of the LED module preceding the cut becomesdisconnected. Because the microcontroller of the LED module precedingthe cut would now recognize that its S1 port is open, it would thenassign itself position No. 0, and by the process described above becomethe new initiating LED module for dynamic addressing. All preceding LEDmodules acquire new addresses corresponding to the new initiating LEDmodule.

FIGS. 17A-17C depict an embodiment of the LED light wire using a seriesand parallel connection. This embodiment allows the LEDs to be turnedthrough 90° (positioned transversely instead of longitudinally) andmounted at a much closer pitch.

As shown in FIGS. 18 thru 19B and 24, the integrally formed LED lightwire may have a plurality of conductors (e.g., conductive bus elementsand conductive segments) which are coupled by zero ohm jumpers orresistors, LEDs, sensors, detectors and/or microprocessors, and aremounted on a support substrate. The functionality of the LED light wireincreases with each additional conductor. For example, a sensor ordetector which monitors environment conditions (such as humidity,temperature, and brightness) may be integrated in the LED light wire,and connected in such a manner that it may influence the lightingcharacteristics of the LED light wire. FIG. 18 shows an embodiment ofthe integrally formed LED light wire with sensors or detectors. Asshown, there are four continuous conductors corresponding to conductivebus elements 30, 32, 33 and 34. Zero ohm jumpers or resistors 10 coupleconductive segments 31 to conductive bus elements 30 and 32. Conductorbus element 32 acts as a common ground. Conductive bus element 30provides power to the LEDs 202, while conductive bus element 34 providespower to the sensor/detector 100. Conductive bus element 33 may directthe signal from the sensor/detector 100 to a power source which suppliespower to the LEDs 202; thereby, allowing the sensor/detector 100 toinfluence the lighting characteristics (e.g., intensity, color, pattern,on/off) of the LEDs 202.

FIGS. 19A and 19B show a full color integrally formed LED light wirehaving three continuous conductors corresponding to conductive buselements L1, L2 and L3 which supply power to the LEDs 202, and conductorsegments S1 and S2 connecting the LEDs 202 to conductive bus elementsL1, L2 and/or L3. In FIG. 19B, the LEDs 202 are SMD-On-Board LEDs.

In another embodiment, each pixel (LED module) may be controlledindependently. FIG. 24 shows the configuration of an individuallycontrollable LED light wire using seven conductors and LED modules 2120.Here, conductive bus element 80 acts as a power ground, while conductivebus element 81 acts as a voltage in. Each LED module 2120 includes amicroprocessor, at least one LED, power input and output connections,control signal input and output connections, and data input and outputconnections. In FIG. 24, the LED modules 2120 include VCC pins, VDDpins, enable pins, clock pins and data pins. The control signal and datainput connections of each LED module are coupled to the control signaland data input connections of an adjacent LED module. An optocoupler maybe used to insulate the control signal line between each LED module. TheLED modules 2120 may be connected in series (for example, as shown inFIG. 24) or in parallel (for example, the power input connections ofeach LED module 2120 is coupled to the first conductive bus element 81and the power output connection of each LED module 2120 is coupled tothe second conductive bus element 80).

A plurality of integrally formed LED light wires (such as LED light wire12, 13, 14) may be aligned side-by-side to form a lighting panel 3000 asshown in FIGS. 25A-25C. Each LED light wire may contain an interlockingalignment system comprising an alignment key 60, 62 and an alignmentkeyhole 61, both of which are pre-formed in the encapsulant of the LEDlight wire, wherein the alignment key 60, 62 and the alignment keyhole61 are located at opposite sides of the LED light wire. The alignmentkey 60, 62 and the alignment keyhole 61, 63 may continuously extend orintermittently extend longitudinally along the length of the LED lightwire. The alignment keyhole 61, 63 may be in the form of a notch, agroove, a recess, a slot, or an aperture, and the alignment key 60, 62may be in a form (including, but without limitation, a rail or a peg)which permits a friction fit (preferably, a snug fit) to the alignmentkeyhole 61, 63. The alignment key 60, 62 may have a width approximatelyequal to or slightly larger than the width of the alignment keyhole 61,63, such that the alignment key 60, 62 may fit therein in a frictionfit, as shown in FIGS. 25B and 25C. As an example, the alignment keyhole61, 63 may be a groove being adapted to friction fit with a rail-shapedalignment key 60, 62, both groove-shaped alignment keyhole 61, 63 andrail-shaped alignment 60 continuously extending longitudinally along thelength of the LED light wire.

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat a variety of alternate and/or equivalent implementations may besubstituted for the specific embodiments shown and described withoutdeparting from the scope of the present invention. This application isintended to cover any adaptations or variations of the specificembodiments discussed herein. Therefore, it is intended that thisinvention be limited only by the claims and the equivalents thereof.

1. An integrally formed LED light wire, comprising a plurality of LEDmodules, each LED module comprising: one or more LEDs; amicrocontroller; and one or more ports, said microcontroller beingconfigured to: check a status of at least one of said one or more ports;if the status of the port corresponds to a predetermined state: assignthe LED module to which said microcontroller belongs to a first displayaddress, and send signals to said microcontroller of a neighboring LEDmodule, said signals assigning respective further display address to theneighboring LED module.
 2. The integrally formed LED light wire of claim1, further comprising a display memory, electrically coupled to saidplurality of LED modules, said display memory storing current displayinformation associated with each of said LED modules in said integrallyformed LED light wire, said current display information stored in saiddisplay memory being accessible by each of the microcontrollers of theLED modules, such that said microcontrollers can retrieve currentdisplay information.
 3. The integrally formed LED light wire of claim 2,further comprising: a display controller, said display controller beingconfigured to update the current display information stored in saiddisplay memory.
 4. The integrally formed LED light wire of claim 1,wherein said one or more LEDs in each said LED module comprise a red,blue, green or white LED.
 5. The integrally formed LED light wire ofclaim 1, wherein said one or more LEDs in each said LED module is eitherred, blue and green LEDs, or red, blue, green and white LEDs.
 6. Anintegrally formed LED light wire, comprising: a first bus element formedfrom a conductive material adapted to distribute power from a powersource; a second bus element formed from a conductive material adaptedto transmit a control signal; a third bus element formed from aconductive material adapted as a ground; at least two LED modules, eachof said LED modules comprising: a microcontroller and at least one LED,said LED module being electrically coupled to said first, second andthird bus elements; one or more ports, said microcontroller beingconfigured to check a status of at least one of said one or more ports,and if the status of the port corresponds to a predetermined state:assign said LED module to which said microcontroller belongs to a firstdisplay address, and send signals to the microcontroller of aneighboring LED module, said signals assigning respective furtherdisplay address to said neighboring LED module.
 7. The integrally formedLED light wire of claim 6, further comprising a display memory,electrically coupled to said at least two LED modules, said displaymemory storing current display information associated with each of theLED modules, said current display information stored in said displaymemory being accessible by each of the microcontrollers of the LEDmodules, such that said microcontrollers can retrieve current displayinformation.
 8. The integrally formed LED light wire of claim 7, furthercomprising: a display controller, said display controller beingconfigured to update the current display information stored in saiddisplay memory.
 9. The integrally formed LED light wire of claim 6,wherein said first, second and third bus elements are made of braidedwire.
 10. The integrally formed LED light wire of claim 6, furthercomprising an encapsulant completely encapsulating said first, second,and third bus elements, and said at least two LED modules.
 11. Theintegrally formed LED light wire of claim 10, wherein said encapsulantfurther comprising light scattering particles.
 12. The integrally formedLED light wire of claim 6, wherein said at least one LED in each saidLED module comprises a red, blue, green or white LED.
 13. The integrallyformed LED light wire of claim 6, wherein said at least one LED in eachsaid LED module is either red, blue and green LEDs, or red, blue, greenand white LEDs.
 14. An integrally formed LED light wire, comprising: asupport substrate; a conductive base mounted on said support substrate,said conductive base comprising a first, second and third conductive buselements, wherein said first conductive bus element is adapted todistribute power from a power source, said second conductive bus elementis adapted to transmit a control signal, and said third conductive buselement is adapted as a ground; at least two LED modules, each of saidLED modules, comprising: a microcontroller and at least one LED, saidLED modules being electrically coupled to said first, second and thirdconductive bus elements; one or more ports, said microcontroller beingconfigured to check a status of at least one of the one or more ports,and if the status of the port corresponds to a predetermined state:assign the LED module to which said microcontroller belongs to a firstdisplay address, and send signals to the microcontroller of aneighboring LED module, said signals assigning respective furtherdisplay address to the neighboring LED module; and a display memory,electrically coupled to said at least two LED modules, said displaymemory storing a current display information for each of said LEDmodules, said current display information stored in said display memorybeing accessible by each LED module, such that said LED modules canrequest and retrieve current display information.
 15. The integrallyformed LED light wire of claim 14, further comprising: a displaycontroller, said display controller being configured to update thecurrent display information stored in said display memory.
 16. Theintegrally formed LED light wire of claim 14, wherein said first, secondand third conductive bus elements are made of braided wire.
 17. Theintegrally formed LED light wire of claim 14, further comprising anencapsulant completely encapsulating said support substrate, saidconductive base, said at least two LED modules.
 18. The integrallyformed LED light wire of claim 17, wherein said encapsulant furthercomprising light scattering particles.
 19. The integrally formed LEDlight wire of any one of claims 1, 6 and 14, wherein the outer profileof the encapsulant comprises an alignment key and an alignment keyholelocated at opposite sides of the integrally formed LED light wire.
 20. Alighting panel comprising a plurality of the integrally formed LED lightwires of claim 19.